TSMC N3B
E286845
TSMC N3B is an advanced 3-nanometer semiconductor manufacturing process variant developed by TSMC, optimized for high-performance, power-efficient chips used in cutting-edge mobile devices.
All labels observed (2)
How this entity was disambiguated
This entity first appeared as the object of triple T2665040 — resolving that mention is where its identity was fixed. The disambiguator weighed these candidate entities and picked the highlighted one (or “None”, minting a new entity). This is how homonymy is resolved: the same surface form can point to different entities.
NED1
Entity disambiguation (via context triple)
gpt-5-mini-2025-08-07
Target entity: TSMC N3B Context triple: [Apple A17 Pro, fabricationNode, TSMC N3B]
-
A.
TSMC
TSMC (Taiwan Semiconductor Manufacturing Company) is the world’s largest dedicated semiconductor foundry, renowned for producing cutting-edge chips for major technology companies.
-
B.
Apple A17 Pro
Apple A17 Pro is a high-performance 3 nm mobile system-on-a-chip designed by Apple for advanced iPhone models, featuring improved CPU, GPU, and AI processing capabilities.
-
C.
Apple A14 Bionic
Apple A14 Bionic is a 5-nanometer ARM-based system-on-a-chip designed by Apple for high-performance, energy-efficient use in iPhones and iPads.
-
D.
Nvidia Tegra X1
The Nvidia Tegra X1 is a mobile system-on-chip that combines ARM CPU cores with an integrated Maxwell-based GPU, widely known for powering devices like the Nintendo Switch.
-
E.
Apple A13 Bionic
The Apple A13 Bionic is a 64-bit ARM-based system-on-a-chip designed by Apple, known for powering the iPhone 11 series and providing advanced performance and machine learning capabilities.
- F. None of above. chosen
- G. Unsure - the case is ambiguous/there is not enough information to decide.
NED2
Entity disambiguation (via description)
gpt-5-mini-2025-08-07
Target entity: TSMC N3B Target entity description: TSMC N3B is an advanced 3-nanometer semiconductor manufacturing process variant developed by TSMC, optimized for high-performance, power-efficient chips used in cutting-edge mobile devices.
-
A.
TSMC
TSMC (Taiwan Semiconductor Manufacturing Company) is the world’s largest dedicated semiconductor foundry, renowned for producing cutting-edge chips for major technology companies.
-
B.
Apple A17 Pro
Apple A17 Pro is a high-performance 3 nm mobile system-on-a-chip designed by Apple for advanced iPhone models, featuring improved CPU, GPU, and AI processing capabilities.
-
C.
Apple A14 Bionic
Apple A14 Bionic is a 5-nanometer ARM-based system-on-a-chip designed by Apple for high-performance, energy-efficient use in iPhones and iPads.
-
D.
Nvidia Tegra X1
The Nvidia Tegra X1 is a mobile system-on-chip that combines ARM CPU cores with an integrated Maxwell-based GPU, widely known for powering devices like the Nintendo Switch.
-
E.
Apple A13 Bionic
The Apple A13 Bionic is a 64-bit ARM-based system-on-a-chip designed by Apple, known for powering the iPhone 11 series and providing advanced performance and machine learning capabilities.
- F. None of above. chosen
Statements (29)
| Predicate | Object |
|---|---|
| instanceOf |
3-nanometer process node
ⓘ
semiconductor manufacturing process ⓘ |
| commercialAvailability | mass production in early 2020s (approximate) ⓘ |
| designUseCase |
application processors
ⓘ
modem and connectivity chips ⓘ |
| developer | TSMC ⓘ |
| featureSizeClass | sub-5-nm ⓘ |
| foundry | TSMC ⓘ |
| isVariantOf |
TSMC N3B
self-linksurface differs
ⓘ
surface form:
TSMC N3
|
| lithographyType | EUV lithography ⓘ |
| manufacturerCountry |
Taiwan, Province of China
ⓘ
surface form:
Taiwan
|
| marketPosition | leading-edge node ⓘ |
| nodeClass | advanced logic process ⓘ |
| optimizationTarget |
high performance
ⓘ
power efficiency ⓘ |
| powerPerformanceAreaFocus | PPA optimization ⓘ |
| predecessorProcess |
TSMC N4
ⓘ
TSMC N5 ⓘ |
| primaryApplication |
cutting-edge mobile devices
ⓘ
mobile system-on-chip ⓘ |
| processFamily |
TSMC N3B
self-linksurface differs
ⓘ
surface form:
TSMC N3
|
| processGeneration | first-generation N3 ⓘ |
| suitableFor | battery-powered devices ⓘ |
| targetCustomers | mobile SoC designers ⓘ |
| targetSegment |
high-end consumer electronics
ⓘ
premium smartphones ⓘ |
| technologyNode | 3 nm ⓘ |
| transistorType |
MOSFETs
ⓘ
surface form:
FinFET
|
| usedIn | Apple A-series SoCs (inferred, not guaranteed for all models) ⓘ |
How these facts were elicited
The pipeline generated the facts above by prompting gpt-5.1 with this entity's name + description and the instruction below.
Instruction
You are a knowledge base construction expert. Given a subject entity and a description of it, return factual statements that you know for the subject as a JSON list of dictionaries(triples), where keys must be "subject", "predicate" and "object". The number of facts may be very high, between 25 to 50 or more, for very popular subjects. For less popular subjects, the number of facts can be very low, like 5 or 10. # Requirements - If you don't know the subject at all, return an empty list. - If the subject is not a named entity, return an empty list. - Include at least one triple where predicate is "instanceOf". - Do not get too wordy. - Separate several objects into multiple triples with one object.
Input
Subject: TSMC N3B Description of subject: TSMC N3B is an advanced 3-nanometer semiconductor manufacturing process variant developed by TSMC, optimized for high-performance, power-efficient chips used in cutting-edge mobile devices.
Referenced by (4)
Full triples — surface form annotated when it differs from this entity's canonical label.
this entity surface form:
TSMC N3
this entity surface form:
TSMC N3
subject surface form:
Apple A17 Pro