packageType
P28919
predicate
Indicates the classification or category of packaging associated with an item or shipment.
All labels observed (2)
| Label | Occurrences |
|---|---|
| packageType canonical | 95 |
| packageTypes | 2 |
Description generation (PDg)
The one-sentence description above was generated by prompting gpt-5.1 with the predicate name and this instruction.
Instruction
Given a predicate that represents a relationship or action between entities, generate a one-sentence description explaining its meaning. # Instructions Focus on describing the relationship, not the entities themselves. # Response Format Begin the description with \' Indicates...\'
Input
Predicate: packageType
Generated description
Indicates the classification or category of packaging associated with an item or shipment.
Sample triples (97)
| Subject | Object |
|---|---|
| MOS Technology SID | DIP-28 ⓘ |
| MOS 6581 | 28-pin DIP ⓘ |
| Apple A10 Fusion | PoP (package on package) ⓘ |
| CTIA | DIP (dual in-line package) NERFINISHED ⓘ |
| AY-3-8912 | DIP ⓘ |
| Apple A5 | PoP ⓘ |
| Apple A9 | package-on-package ⓘ |
| MOS Technology VIC-II | 40-pin DIP ⓘ |
| Apple A6 | PoP (Package on Package) NERFINISHED ⓘ |
| Apple A6X | PoP ⓘ |
| Apple A4 | PoP (package on package) ⓘ |
| Apple A7 | PoP (package on package) ⓘ |
| @sveltejs/adapter-node | npm package ⓘ |
| Intel Core Duo | micro-FCPGA ⓘ |
| Intel Core Duo | micro-FCBGA ⓘ |
| Intel Pentium II | Single Edge Contact Cartridge ⓘ |
| Intel 80386 | PGA ⓘ |
| Intel Pentium 90 | ceramic PGA ⓘ |
| Cherry Trail | BGA ⓘ |
| Intel Pentium 100 | ceramic PGA ⓘ |
| Intel Pentium 100 | plastic PGA ⓘ |
| AMD K6-2 | CPGA ⓘ |
|
Intel Lakefield platform
surface form:
Intel Lakefield
|
3D-stacked package ⓘ |
| Socket AM3 | PGA-ZIF ⓘ |
| Z84C00 | DIP ⓘ |
| Z84C00 | PLCC ⓘ |
| Z84C00 | QFP ⓘ |
| Hitachi HD64180 | DIP ⓘ |
| Hitachi HD64180 | QFP ⓘ |
| Intel 4040 | DIP-24 ⓘ |
| Amber Lake-Y | FCBGA ⓘ |
| R4000 | PGA NERFINISHED ⓘ |
| DragonBall | QFP ⓘ |
| Apple S1 | sealed resin-encapsulated module ⓘ |
| A11 Bionic | system-on-a-chip ⓘ |
| Yamaha YM2203 | DIP ⓘ |
| Yamaha YMF276 | LSI IC package (various OEM-specific packages) ⓘ |
| OPM | DIP package ⓘ |
|
Motorola 56001 DSP
surface form:
Motorola 56001
|
plastic quad flat pack ⓘ |
|
Motorola 56001 DSP
surface form:
Motorola 56001
|
ceramic package ⓘ |
| IBM Gekko | flip-chip BGA ⓘ |
| Motorola 6802 | DIP ⓘ |
| Cobra | PGA NERFINISHED ⓘ |
| LM101 operational amplifier | TO-99 metal can ⓘ |
| LM101 operational amplifier | DIP ⓘ |
| AMD Instinct MI300 series | multi‑chip module ⓘ |
| A13 Bionic | system-in-package ⓘ |