UltraFusion

E202476

UltraFusion is Apple’s custom high-bandwidth die-to-die interconnect technology that links two M1 Max chips into a single M1 Ultra system-on-a-chip.

All labels observed (1)

Label Occurrences
UltraFusion canonical 3

How this entity was disambiguated

Statements (29)

Predicate Object
instanceOf Apple silicon technology
die-to-die interconnect technology
announcedBy Apple Inc.
announcedWith Apple M1 Ultra
announcementEvent Apple March 2022 event
bandwidth 2.5 TB/s
connects Apple M1 Max
surface form: M1 Max

two M1 Max dies
designGoal to avoid NUMA-like complexity for software
to provide very high inter-die bandwidth
developer Apple Inc.
enables software to see two M1 Max dies as a single SoC
unified memory architecture across two M1 Max dies
generation first generation Apple UltraFusion interconnect
interconnectType high-bandwidth die-to-die interconnect
marketedAs UltraFusion self-link
partOf Apple silicon platform
purpose to link two M1 Max chips into a single system-on-a-chip
relatedTo advanced packaging technologies
chiplet-based SoC design
supports low-latency communication between dies
technologyDomain semiconductor interconnects
system-on-a-chip design
usedFor scaling CPU performance
scaling GPU performance
scaling memory bandwidth
usedIn Apple M1 Ultra
usedInProductLine Mac Studio
usedWith Apple M1 Max

How these facts were elicited

Referenced by (3)

Full triples — surface form annotated when it differs from this entity's canonical label.

UltraFusion marketedAs UltraFusion self-link