Triple
T28900139
| Position | Surface form | Disambiguated ID | Type / Status |
|---|---|---|---|
| Subject | Eurocard |
E732930
|
entity |
| Predicate | instanceOf |
P0
|
FINISHED |
| Object | electronic packaging standard |
C24735
|
CONCEPT FINISHED |
How this triple was built (1 step)
Every LLM step that produced this triple, in pipeline order — named-entity classification, the disambiguation choices (the exact options shown, with the pick highlighted), and the generated description. The batch + timestamp of each is in the Provenance table below.
CD
Concept disambiguation
gpt-5-mini-2025-08-07
Target class: electronic packaging standard Context triple: [Eurocard, instanceOf, electronic packaging standard]
-
A.
integrated circuit package
An integrated circuit package is a protective housing that encapsulates a semiconductor chip and provides standardized electrical connections between the chip and the external circuitry.
-
B.
surface-mount device package
A surface-mount device package is a compact electronic component housing designed to be mounted directly onto the surface of a printed circuit board without through-hole leads.
-
C.
JEDEC standard
chosen
A JEDEC standard is a formal specification developed by the JEDEC Solid State Technology Association that defines common requirements and guidelines for the design, performance, testing, and interoperability of semiconductor and microelectronic components.
-
D.
IEEE standard
An IEEE standard is a formally documented set of technical specifications and guidelines developed and maintained by the Institute of Electrical and Electronics Engineers to ensure interoperability, safety, and quality across electrical, electronic, and computing technologies.
-
E.
DIN standard
A DIN standard is a formal technical specification developed by the German Institute for Standardization (DIN) that defines uniform criteria, dimensions, methods, or quality requirements for products, processes, and services.
- F. None of above.
Provenance (1 batch)
The batch behind each pipeline step, in order, with when it ran. Timestamps are batch-level — stages were processed in waves, so the object chain (NER → NED1 → NEDg → NED2) reads in order, but predicate / elicitation batches can sit in a different wave.
| Step | Stage | Batch ID | Status | When |
|---|---|---|---|---|
| creating | Elicitation | batch_69f05b08c2008190ac426a035a2ed66d |
completed | April 28, 2026, 7 a.m. |
Created at: April 28, 2026, 8:02 a.m.