Triple

T17537407
Position Surface form Disambiguated ID Type / Status
Subject Tensor G3 E427096 entity
Predicate fabricationProcess P625 FINISHED
Object Samsung 4LPP+ process NE NERFINISHED

How this triple was built (2 steps)

Every LLM step that produced this triple, in pipeline order — named-entity classification, the disambiguation choices (the exact options shown, with the pick highlighted), and the generated description. The batch + timestamp of each is in the Provenance table below.

NER Named-entity recognition gpt-5-mini
Instruction
Given a phrase, classify it is english named entity (e.g., persons, organizations, works of art) in Latin script, or not (e.g., literals, dates, URLs, verbose phrases). For disambiguation, the statement where the phrase occurs as object is also given. Please return a JSON object with `phrase` (string, the phrase being analyzed) and `is_ne` (boolean, indicating whether the phrase is a Named Entity).
Input
Phrase: Samsung 4LPP+ process | Statement: [Tensor G3, fabricationProcess, Samsung 4LPP+ process]
NED1 Entity disambiguation (via context triple) gpt-5-mini-2025-08-07
Target entity: Samsung 4LPP+ process
Context triple: [Tensor G3, fabricationProcess, Samsung 4LPP+ process]
  • A. Samsung FinFET process technologies chosen
    Samsung FinFET process technologies are advanced semiconductor manufacturing nodes that use three-dimensional fin-shaped transistors to improve performance, power efficiency, and scaling for chips such as Exynos SoCs.
  • B. TSMC 4N
    TSMC 4N is a custom 5 nm-class semiconductor manufacturing process co-developed by TSMC and NVIDIA, optimized specifically for NVIDIA’s latest GPUs to improve performance, power efficiency, and density over previous nodes.
  • C. TSMC N4
    TSMC N4 is an enhanced 5 nm-class semiconductor manufacturing process node from Taiwan Semiconductor Manufacturing Company, offering improved performance and density over its earlier 5 nm technologies.
  • D. TSMC N7P
    TSMC N7P is an enhanced 7-nanometer semiconductor manufacturing process from TSMC that offers improved performance and power efficiency over its predecessor and is used for advanced mobile and computing chips.
  • E. TSMC N3B
    TSMC N3B is an advanced 3-nanometer semiconductor manufacturing process variant developed by TSMC, optimized for high-performance, power-efficient chips used in cutting-edge mobile devices.
  • F. None of above.
  • G. Unsure - the case is ambiguous/there is not enough information to decide.

Provenance (2 batches)

The batch behind each pipeline step, in order, with when it ran. Timestamps are batch-level — stages were processed in waves, so the object chain (NER → NED1 → NEDg → NED2) reads in order, but predicate / elicitation batches can sit in a different wave.

Step Stage Batch ID Status When
creating Elicitation batch_69d889de677081909b22d2657b1f0292 completed April 10, 2026, 5:25 a.m.
NER Named-entity recognition batch_69e4536d03dc81908b8a58f66657c01a completed April 19, 2026, 4 a.m.
Created at: April 10, 2026, 5:49 a.m.