HBM3
E1033644
HBM3 is a high-bandwidth memory standard used in advanced GPUs and accelerators to provide extremely fast, power-efficient access to large amounts of data.
Statements (46)
| Predicate | Object |
|---|---|
| instanceOf |
DRAM memory standard
ⓘ
high-bandwidth memory standard ⓘ |
| category |
computer memory standard
ⓘ
graphics memory ⓘ server memory technology ⓘ |
| comparedTo | HBM2E NERFINISHED ⓘ |
| connectedTo |
GPU die
ⓘ
accelerator die ⓘ |
| connectedVia | silicon interposer ⓘ |
| designedFor |
high-bandwidth memory access
ⓘ
large-scale data processing ⓘ power-efficient memory access ⓘ |
| enables |
faster model training
ⓘ
higher GPU utilization ⓘ larger model sizes ⓘ |
| feature |
3D die stacking
ⓘ
high capacity per stack ⓘ low power per bit transferred ⓘ short signal paths ⓘ through-silicon vias ⓘ |
| follows | HBM2E NERFINISHED ⓘ |
| hasAdvantageOver |
HBM2E in bandwidth
ⓘ
HBM2E in energy efficiency ⓘ |
| integrationMethod |
2.5D packaging
ⓘ
advanced packaging technologies ⓘ |
| interfaceType | wide I/O ⓘ |
| memoryType |
3D DRAM
ⓘ
stacked DRAM ⓘ |
| optimizedFor |
AI inference workloads
ⓘ
AI training workloads ⓘ high-performance computing workloads ⓘ |
| partOf | HBM memory family NERFINISHED ⓘ |
| standardizedBy | JEDEC NERFINISHED ⓘ |
| supports | very high memory bandwidth ⓘ |
| targetMarket |
AI supercomputers
ⓘ
data centers ⓘ enterprise GPUs ⓘ |
| typicalFormFactor | multi-die memory stack ⓘ |
| usedFor |
GPU-based cloud services
ⓘ
data analytics accelerators ⓘ large language model training ⓘ scientific simulations ⓘ |
| usedIn |
AI accelerators
NERFINISHED
ⓘ
GPUs ⓘ HPC accelerators ⓘ data center processors ⓘ |
Referenced by (1)
Full triples — surface form annotated when it differs from this entity's canonical label.