HBM2

E1033643

HBM2 is a high-bandwidth second-generation stacked memory technology used in advanced GPUs and accelerators to provide very fast, energy-efficient data access.

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Statements (47)

Predicate Object
instanceOf JEDEC memory standard
high-bandwidth memory standard
stacked DRAM technology
applicationDomain graphics rendering
high‑performance data analytics
machine learning
scientific computing
comparedTo GDDR5 NERFINISHED
dataRatePerPin up to 2 Gbit/s per pin
follows HBM NERFINISHED
generation second generation HBM
hasProperty 3D stacked
energy efficient
high bandwidth
low power consumption
short interconnect distance to processor
wide I/O interface
interconnectTechnology TSVs
through‑silicon vias
introducedAround 2016
maxBandwidthPerStack up to 256 GB/s
maxCapacityPerStack up to 8 GB
memoryType DRAM
offers higher bandwidth than GDDR5
lower power per bit than GDDR5
optimizedFor high memory bandwidth workloads
parallel processing
packaging 2.5D integration
silicon interposer
provides high memory bandwidth close to compute die
very fast data access
stackHeight up to 8 DRAM dies
standardizedBy JEDEC NERFINISHED
successor HBM2E NERFINISHED
HBM3 NERFINISHED
typicalBusWidthPerStack 1024‑bit GENERATED
usedBy AI accelerator cards
AMD GPUs NERFINISHED
NVIDIA GPUs NERFINISHED
usedIn AI accelerators
GPUs
accelerators
data center accelerators
graphics processing units
high‑performance computing systems
networking equipment
supercomputers

Referenced by (1)

Full triples — surface form annotated when it differs from this entity's canonical label.

Instinct supports HBM2
subject surface form: AMD Instinct