system-in-package
C24316
concept
A system-in-package is an integrated circuit assembly that combines multiple functional components, such as processors, memory, and passive elements, into a single compact package to form a complete electronic subsystem.
Observed surface forms (1)
- system in package ×1
Instances (3)
- Apple S-series
- Apple S1
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Apple S‑series chip
via concept surface "system in package"
surface form: Apple S-series chip